SiO2包裹纳米Cu粒子/环氧树脂复合材料及其在芯片封装领域的应用

为提高微电子封装材料的散热性能并保留其良好的电绝缘性能,以环氧树脂为基体,二氧化硅包裹纳米铜粒子(SiO2-Cu)为填料,采用机械混炼法制备了芯片封装用SiO2-Cu环氧树脂复合材料。采用SEM和TEM研究了SiO2-Cu纳米粒子在环氧树脂中的分散情况;研究了填料对复合材料导热系数、热膨胀系数(CTE)和力学性能的影响。结果表明:SiO2-Cu纳米粒子在环氧树脂中分散性良好;复合材料的导热系数随SiO2-Cu纳米粒子填充量的增加而增大,填充量(体积分数)超过25%时导热系数开始下降,SiO2-Cu纳米粒子适宜用量为总体积的25%;随着填料的增加,复合材料的CTE减小;当SiO2-Cu纳米粒子填充量为25%时,用于芯片封装材料时具有良好的抗冲击性能和较长的电迁移失效时间。

Heat dissipation composites prepared by SiO 2 coated Cu nanoparticles

A silicon dioxide-copper(SiO2-Cu)epoxy resin composite material for chip packaging was made by a mechanical mixing method with epoxy resin as the base glue and SiO2 coated with nano-Cu(SiO2-Cu)particles as the filler.The dispersion of SiO2-Cu nanoparticles in epoxy resin was studied using scanning electron microscopy and transmission electron microscopy.Meanwhile,the effects of the filler on the coefficient of thermal conductivity,the coefficient of thermal expansion(CTE),and the mechanical properties of the composite material were also studied.The results show that SiO2-Cu nanoparticles disperse well in the epoxy resin,the coefficient of thermal conductivity of SiO2-Cu epoxy resin composites increases with an increase in the SiO2-Cu filler amount,the coefficient of thermal conductivity begins to decline when the filling volume is over 25%,and the suitable amount of SiO2-Cu is 25%of the total volume.With the increase in the filler,the CTE of the composite decreases;when the SiO2-Cu filling amount is 25%,the material has good impact resistance and a long electromigration failure time for chip packaging materials.