倒装焊技术及应用

随着集成电路封装密度的提高,传统引线键合技术已经无法满足要求,倒装焊技术的发展能够解决该问题,并且得到了广泛的应用。文章介绍了倒装焊中的4种关键工艺技术,即UBM制备技术、凸点制备方法、倒装和下填充技术。其中凸点制备技术直接决定着倒装焊技术的好坏,为满足不同产品的需求,出现了不同的凸点制备技术,使倒装焊技术具备了好的发展前景。文章对各工艺技术的应用特点进行了阐述,并对倒装焊技术的发展前景进行了展望。

Flip Chip Technology and Its Application

With development of high-density package,the conventional wire bonding technology had not been satisfied for the product need,but the development of flip chip technology can solve this problem and flip chip has been widely used. In the paper,four key technologies were introduced,which were under bump metallurgy,bumping technology,assembly technology and underfill technology. The bumping technology directly af-fected the quality of the flip chip technology. In order to satisfy the need of different productio...