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Smart optical measurement probe for autonomously detecting nano-defects on bare semiconductor wafer surface: Verification of proposed concept
Affiliation:The University of Tokyo, Hongo 7-3-1, Bunkyo-ku, Tokyo, 113-8656, Japan;University of Waterloo, 200 University Ave. West, N2L3G1, Waterloo, ON, Canada;Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China
Abstract:We propose a new method of inspecting a surface for fine defects that combines the optical inspection method with observation of the physical behavior of a liquid. A liquid thin film on a substrate behaves as a near-field physical probe that autonomously captures nano-particulate defects. Optical observation of the interfacial behavior of the liquid thin film is used to detect minute defects. This method combines the characteristics of optical detection (i.e., detection from a remote field and simultaneous detectability on a plane) and the high sensitivity of a physical near-field probe. We examined the basic principles of the proposed method through numerical calculation and applied it in experiments to detect fine particulate defects on a silicon substrate for semiconductor manufacturing to demonstrate the validity of the basic concept of the proposed method.
Keywords:Surface inspection  Optical inspection  Defect inspection  Liquid probe  Particulate defect
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