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GaNHEMT栅源与栅漏表面态与电流崩塌相关性探讨
引用本文:靳翀,卢盛辉,杜江锋,罗谦,周伟,夏建新,杨谟华.GaNHEMT栅源与栅漏表面态与电流崩塌相关性探讨[J].微纳电子技术,2006,43(6):270-273.
作者姓名:靳翀  卢盛辉  杜江锋  罗谦  周伟  夏建新  杨谟华
作者单位:电子科技大学微电子与固体电子学院,成都,610054
摘    要:基于实验测试数据,综合分析了栅源、栅漏串联电阻增大后电流崩塌I-V曲线变化差异。研究表明:在脉冲测试条件下,RS增大,栅下沟道开启程度减弱,漏电流ID变小;RD增大,栅下沟道漏端等效漏电压减小,膝电压VKNEE变大。该实验结果可望通过RD与RS表征研究导致GaNHEMT电流崩塌的表面态变化。

关 键 词:电流崩塌  串联电阻  氮化镓高电子迁移率晶体管  表面态
文章编号:1671-4776(2006)06-0270-03
修稿时间:2005年12月17

Comparison of the Gate-Drain and Gate-Source Effects of GaN HEMT on Current Collapse
JIN Chong,LU Sheng-hui,DU Jiang-feng,LUO Qian,ZHOU Wei,XIA Jian-xin,YANG Mo-hua.Comparison of the Gate-Drain and Gate-Source Effects of GaN HEMT on Current Collapse[J].Micronanoelectronic Technology,2006,43(6):270-273.
Authors:JIN Chong  LU Sheng-hui  DU Jiang-feng  LUO Qian  ZHOU Wei  XIA Jian-xin  YANG Mo-hua
Abstract:Based on the measurement results,I-V characteristics before and after gate-source resistance and gate-drain resistance increased were compared.Increasing of gate-source resistance leads pinch-off of the channel,which makes saturated current decrease.The increasing of gate-drain resistance reduces effective drain voltage of the intrinsic channel,knee voltage becomes large consequently.This result is thought to describe the current collapse after stress quantitively.
Keywords:current collapse  series resistance  GaN HEMT  surface state
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