Microstructure, residual stresses and shear strength of diamond-steel-joints brazed with a Cu-Sn-based active filler alloy |
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Authors: | Sebastian Buhl Christian LeinenbachRalph Spolenak Konrad Wegener |
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Affiliation: | a Institute of Machine Tools and Manufacturing, ETH Zurich, 8092 Zurich, Tannenstrasse 3, Switzerlandb Laboratory for Joining and Interface Technology, EMPA Duebendorf, 8600 Duebendorf, Ueberlandstrasse 129, Switzerlandc Laboratory for Nanometallurgy, ETH Zurich, 8093 Zurich, Wolfgang-Pauli-Strasse 10, Switzerland |
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Abstract: | Brazing of diamonds is important in grinding technology. The brazing parameters can strongly influence the grinding tool's performance. In this work a Cu-Sn-based active filler alloy (73.9 Cu-14.4 Sn-10.2 Ti-1.5 Zr, wt.%) was applied to join monocrystalline block-shaped diamonds onto a stainless steel substrate using three different brazing temperatures (880, 930 and 980 °C) and two different dwell times (10 and 30 min), respectively. The characteristics of the joints were investigated by means of scanning electron microscopy and energy dispersive X-ray spectroscopy (microstructure and phase composition), by Raman-spectroscopy (residual stress) as well as by shear testing (bond strength). The microstructural investigations revealed an intermetallic interlayer of type Fe2Ti at the steel-filler alloy interface, which grew with increasing brazing temperatures and longer dwell durations. The brazing parameters strongly affected the residual stresses in the diamond. Compressive residual stresses with a maximum value of − 350 MPa were found in the samples brazed at 880 and 930 °C, whereas tensile stresses of maximum + 150 MPa were determined in samples joined at 980 °C. The effect of the brazing parameters on the shear strength is very pronounced. The shear strength decreased from (321 ± 107) MPa at 880 °C, 10 min to (78 ± 30) MPa at 980 °C, 30 min. |
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Keywords: | Brazing Diamond Residual stress Microstructure Shear strength |
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