首页 | 本学科首页   官方微博 | 高级检索  
     

MgO-Y_2O_3对热压烧结Al_2O_3性能的影响
引用本文:陆鑫翔,王文瀚,李晓云,丘泰.MgO-Y_2O_3对热压烧结Al_2O_3性能的影响[J].电子元件与材料,2013,32(1):1-4.
作者姓名:陆鑫翔  王文瀚  李晓云  丘泰
作者单位:南京工业大学材料科学与工程学院,江苏 南京,210009
基金项目:长江学者和创新团队发展计划(PCSIRT)资助项目(No.IRT1146);江苏高校优势学科建设工程资助项目
摘    要:以高纯的硫酸铝氨分解的无定形Al2O3为原料,MgO-Y2O3为烧结助剂,在N2气氛下热压烧结制备Al2O3陶瓷。研究了烧结助剂掺量对Al2O3材料的相组成、显微结构、烧结性能、力学性能、热导率和介电性能的影响。结果表明:所制Al2O3陶瓷具有细晶的显微结构特征和超高的抗弯强度。随着MgO-Y2O3掺量的增加,晶粒尺寸、抗弯强度和热导率先增大后减小,而介电损耗则呈现先减小后增大的变化规律。当MgO和Y2O3掺量均为质量分数2%时,Al2O3陶瓷呈现为较佳的综合性能:抗弯强度达最大值为603 MPa,热导率为36.47 W.m–1.K–1,介电损耗低至6.32×10–4。

关 键 词:Al2O3  热压烧结  显微结构  抗弯强度  热导率  介电性能

Effect of MgO-Y2O3 on properties of Al2O3 materials prepared by hot-pressing sintering
LU Xinxiang,WANG Wenhan,LI Xiaoyun,QIU Tai.Effect of MgO-Y2O3 on properties of Al2O3 materials prepared by hot-pressing sintering[J].Electronic Components & Materials,2013,32(1):1-4.
Authors:LU Xinxiang  WANG Wenhan  LI Xiaoyun  QIU Tai
Affiliation:(College of Material Science and Engineering,Nanjing University of Technology,Nanjing 210009,China)
Abstract:Al2O3 ceramics were prepared by hot-pressing sintering in N2 atmosphere,with amorphous Al2O3 decomposed from high-purity aluminum ammonium sulfate as raw material and MgO-Y2O3 as additives.The effects of sintering additives content on the phase formation,microstructure,sintering properties,mechanical properties,thermal conductivity and dielectric properties of the Al2O3 ceramics were investigated.The results show that the Al2O3 ceramics exhibite fine-grained microstructure and consequently excellent bending strength,with the increase of content of MgO-Y2O3,the average grain size,bending strength and the thermal conductivity increase first,and then decrease,and the case is on the contrary for dielectric loss.When the contents of MgO-Y2O3 both are 2%(mass fraction),the materials show superior comprehensive properties: the bending strength of the sample is 603 MPa,which is reached to the maximun,thermal conductivity of 36.47 W?m–1?K–1,and the lowest dielectric loss of 6.32×10–4.
Keywords:Al2O3  hot-pressing sintering  microstructure  bending strength  thermal conductivity  dielectric properties
本文献已被 CNKI 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号