Sn-Cu系无松香无卤免清洗助焊剂研制

将低沸点与高沸点的有机酸进行复配,添加沸点接近波峰焊温度的混合溶剂及其他添加剂,得到了一种用于Sn-Cu系波峰焊无铅焊锡的助焊剂。测试结果表明:当丁二酸、衣康酸、己二酸、三异丙醇胺的质量比为4∶2∶3∶1,有机酸活化剂质量分数为5%,表面活性剂质量分数为0.15%,成膜剂质量分数为0.50%,有机溶剂质量分数为15%,余量为去离子水时,助焊剂溶液的pH值约为4,钎料焊后的铺展率接近于77%,焊点饱满光亮,对铜板腐蚀性小,焊后无残留,绝缘性良好。

Research of rosin-free halogen-free and free-clean flux for Sn-Cu solders

By matching the low and high boiling point organic acids,then adding the mixed solvent with the boiling point closed to the wave-soldering temperature and other additives,a kind of the flux used for wave-soldering and lead-free Sn-Cu solder was got.The results show that the raw material ratio and technological conditions for preparing the high-quality flux are: succinic acid,itaconic acid,adipic acid and tri-isopropanolamine are mixed at the mass ratio of 4:2:3:1;the mass fraction of organic acid activator,surfactant,menberance forming agent,organic solvent and de-ionized water are 5%,0.15%,0.50%,15% and the residcee respectively and controlling the solution pH to approximately 4.The prepared flux has many excellent peformances: spreading rate of the solder nearly come to 77%,full and bright solder joint,little corrosion to copperplate,no residual and good insulating properties.