| 内串联型二极管封装产品研发 |
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| 引用本文： | 方逸裕,鄢胜虎. 内串联型二极管封装产品研发[J]. 电子与封装, 2014, 0(3): 14-17 |
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| 作者姓名： | 方逸裕 鄢胜虎 |
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| 作者单位： | 汕头华汕电子器件有限公司,广东汕头515041 |
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| 摘 要： | 介绍一种新封装半导体器件的研发。通过对产品开发过程中各技术难点及相应解决方案的介绍,展现该产品的主要研发过程和所涉及到的关键技术难点。关键技术难点包括引线框架设计、设备改造、工艺控制等。引线框架(一种正向串联的二极管框架结构)设计产品的总体结构问题,是该过程的第一技术关键点。设备改造和工艺控制解决了生产实现和质量控制问题。
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| 关 键 词： | 内串联型二极管 二极管 工艺控制 |
Research and Development of Packaging for the Tandem Type Diode |
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| FANG Yiyu,YAN Shenghu. Research and Development of Packaging for the Tandem Type Diode[J]. Electronics & Packaging, 2014, 0(3): 14-17 |
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| Authors: | FANG Yiyu YAN Shenghu |
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| Affiliation: | (Shantou Huashan Electronic Devices Co., Ltd., Shantou 515041, China) |
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| Abstract: | The paper mainly introduces the development of a new package of semiconductor device. The technical difficulties of the product development process and the corresponding solutions are presented, showing the main R＆amp;D process of the product and the key technical problems. The key technical problems including the lead frame design, equipment modiifcation, process control. Lead frame design（a frame structure for positive series of diode）determines the overall structure of the product, is the ifrst technical key points of the process. Modiifcation of equipment and process control to solve the production and quality control. |
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| Keywords: | tandem type diode diode technology control |
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