| 热仿真设计在陶瓷封装中的应用研究 |
| |
| 引用本文： | 仝良玉,蒋长顺,张元伟,张嘉欣.热仿真设计在陶瓷封装中的应用研究[J].电子与封装,2014(6):1-3. |
| |
| 作者姓名： | 仝良玉 蒋长顺 张元伟 张嘉欣 |
| |
| 作者单位： | 无锡中微高科电子有限公司,江苏无锡214035 |
| |
| 摘 要： | 热仿真设计可以对封装产品进行散热性能评估,对缩短产品设计周期、提高产品热可靠性有着重要的意义。采用有限元方法对陶瓷封装器件进行了结壳热阻(θJC)的仿真分析。仿真结果显示,当采用两种不同方法进行边界条件处理时,所得仿真结果产生一定的差异。分析认为,陶瓷基板散热条件的变化会对最终的热阻值造成一定的影响。热电测试法被用来进行实物封装的热阻测量,测试时采用的导热胶会对最终的测试结果产生影响。仿真与测试结果对比显示,仿真方法可以获得较精确的结果。
|
| 关 键 词： | 有限元方法 热分析 陶瓷封装 热阻 |
Application Study of Thermal Simulation in Ceramic Packaging Design |
| |
| TONG Liangyu,JIANG Changshun,ZHANG Yuanwei,ZHANG Jiaxin.Application Study of Thermal Simulation in Ceramic Packaging Design[J].Electronics & Packaging,2014(6):1-3. |
| |
| Authors: | TONG Liangyu JIANG Changshun ZHANG Yuanwei ZHANG Jiaxin |
| |
| Affiliation: | ( Wuxi Zhongwei High-tec electronics co. Ltd, Wuxi 214035, China) |
| |
| Abstract: | Thermal simulation could be used for the thermal performance evaluation of IC packaging, and has a positive meaning in reducing design cycle and improving thermal reliability. Finite element method （FEM） is used for the thermal resistance （θJC） analysis of a ceramic packaging product. Different results are obtained when using two different boundary conditions. It shows that the difference in θJC is caused by the variation of heat transferring coefficient on the ceramic substrate. θJC of the product is tested with electrical test method （ETM）, and the thermal grease used in the experiment will affect the test results. Simulation results show good accordance with the test results. |
| |
| Keywords: | finite element method （FEM） thermal analysis ceramic packaging thermal resistance |
| 本文献已被 CNKI 维普 等数据库收录！ |
|
