| MCM-C基板上的多层互连及厚膜电阻的可靠性研究 |
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| 引用本文： | 郭春生,李志国.MCM-C基板上的多层互连及厚膜电阻的可靠性研究[J].电子学报,2005,33(8):1519-1522. |
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| 作者姓名： | 郭春生 李志国 |
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| 作者单位： | 北京工业大学电子信息与控制工程学院,北京,100022;北京工业大学电子信息与控制工程学院,北京,100022 |
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| 摘 要： | 重点研究了MCM-C基板中多层互连和厚膜电阻的可靠性.试验采用温度应力和电应力的双应力加速寿命试验.试验发现,温度小于180℃时互连失效在MCM-C基板失效中占主要地位,膜电阻失效相对互连失效可忽略不计.在温度高于180℃时膜电阻失效将起较大作用,即膜电阻比互连温度加速系数要大.重点计算了膜电阻和互连寿命分布及加速系数.
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| 关 键 词： | 多芯片组件 互连 厚膜电阻 加速寿命试验 |
| 文章编号： | 0372-2112（2005）08-1519-04 |
| 收稿时间： | 2004-06-21 |
| 修稿时间： | 2004-06-212005-03-16 |
Study on Reliability of Multi-Layer Interconnection and Thick-Film Resistors in MCM-C Substrates |
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| GUO Chun-sheng,LI Zhi-guo.Study on Reliability of Multi-Layer Interconnection and Thick-Film Resistors in MCM-C Substrates[J].Acta Electronica Sinica,2005,33(8):1519-1522. |
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| Authors: | GUO Chun-sheng LI Zhi-guo |
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| Affiliation: | College of Electronic Information and Control Engineering,Beijing University of Technology,Beijing 100022,China |
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| Abstract: | The paper mainly studies the reliability of multi-layer intercnonections,vias and thick-film resistors in Multi-chip Module-Ceramic(MCM-C) substrates.Temperature stress and voltage stress are used to accelerate the life test.The results show that when the temperature is under 180℃,the failure of metal lines plays a much more important role than the failure of film resistors;but when it's over 180℃,the failure of film resistors will also be important.The paper also calculated the lifetime and accelerating coefficient of metal lines and thick-film resistors. |
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| Keywords: | MCM interconnection thick-film resistors accelerated life test |
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