| 引线框架级进模设计 |
| |
| 引用本文： | 尹文斌.引线框架级进模设计[J].模具工业,2003(10):14-16. |
| |
| 作者姓名： | 尹文斌 |
| |
| 作者单位： | 天水永红器材厂,甘肃,天水,741000 |
| |
| 摘 要： | 介绍了集成电路封装用引线框架级进模的排样设计和模具结构 ,还介绍了凸模、凹模、凸模固定板、卸料板、卸料板座等主要零件的特点 ,此模具结构应用于实践中取得了良好的效果 ,对同类模具的设计制造有一定的借鉴作用。
|
| 关 键 词： | 引线框架 排样 级进模 |
| 文章编号： | 1001-2168(2003)10-0014-03 |
| 修稿时间： | 2003年4月23日 |
Design of the Progressive Die for the Lead Frame |
| |
| YIN Wen-bin.Design of the Progressive Die for the Lead Frame[J].Die & Mould Industry,2003(10):14-16. |
| |
| Authors: | YIN Wen-bin |
| |
| Abstract: | The layout design and structure of the progressive die for the lead frame used for the IC packaging were introduced. The characteristics of the main parts of the die such as the punch, matrix, punch plate, stripping plate and stripping plate holder were stated. This die structure made good results in application and has certain reference value to the design and manufacture of similar dies. |
| |
| Keywords: | lead frame layout progressive die |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
