Kinematics of a single abrasive particle during the industrial polishing process of porcelain stoneware tiles |
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| Affiliation: | 1. Postgraduate Program in Material Science Engineering (PGMat/EMC/LabMat), Federal University of Santa Catarina (UFSC), Department of Mechanical Engineering, Campus Universitário Trindade, LabMat, EMC-B, Postcode 88040-900, CP 476, Florianópolis, SC, Brazil;2. Institute for Manufacturing Engineering and Production Management, University of Kaiserslautern, PO Box 3049, D-67653 Kaiserslautern, Germany;3. Department of Mechanical Engineering, EMC, Federal University of Santa Catarina (UFSC), Postcode 88040-900, CP 476, Florianópolis, SC, Brazil;1. Namiki Precision Jewel Co., Ltd., 3-8-22 Shinden, Adachi-ku, Tokyo 123-8511, Japan;2. Kastec, Kyushu University, Kasuga-shi, Fukuoka 816-8580, Japan;1. College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China;2. Department of Mechanical and Electrical Engineering, University of Electronic Science and Technology of China, Chengdu, 610054, China;3. Research Center of Laser Fusion, China Academy of Engineering Physics, Mianyang, 621900, China;4. Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen, 361005, China;1. Key Laboratory of Education Ministry for Modern Design and Rotor-Bearing System, School of Mechanical Engineering, Xi''an Jiaotong University, Xi''an, PR China;2. Department of Micro Engineering, Kyoto University, Kyoto, Japan;3. Department of Mechanical Systems Engineering, Hiroshima University, Higashi-Hiroshima, Japan |
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| Abstract: | ![]()
In order to achieve glossiness the porcelain stoneware tiles must undergo an industrial polishing process, which can be optimized by either the scratching phenomena or the polishing kinematics. This paper is focused on the latter. Thus, the most important kinematic equations involved in polishing process were described. The lateral oscillation used in modern polishing machines, as well as the other available motions were taken into account. The trajectory of abrasives, the scratching speed and the curvature radius could be obtained for each instant. The importance of adopting good kinematics parameters for the accomplishment of the polishing process was highlighted, and the equations furnished hereby serve as useful tools for further attempts in optimizing the polishing process. |
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