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| 在无铅环境中的热风整平 | |
| 引用本文： | 丁志廉.在无铅环境中的热风整平[J].印制电路信息,2006(12):40-44. |
| 作者姓名： | 丁志廉 |
| 摘 要： | 当电子工业走向无铅焊接的时候,热风焊料整平仍然是继续可焊性保护的优选方法。 |
| 关 键 词： | 热风焊料整平 无铅焊接 锡/铜/钴合金 锡/铅(63/37)合金 湿润特性 |
Hot Air Leveling in the Lead-free Environment |
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| Ding Zhilian.Hot Air Leveling in the Lead-free Environment[J].Printed Circuit Information,2006(12):40-44. | |
| Authors: | Ding Zhilian |
| Affiliation: | Ding Zhilian |
| Abstract: | As the electronics industry to lead-free soldering,hot air leveling should continue to be preferredmethod of preserving solderability. |
| Keywords: | HASL lead-free soldering Sn/Cu/Co alloys Sn/Pb(63/37) alloys wetting charactericts |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |