合金元素对Cu-Te-Cr合金时效组织与性能的影响

采用扫描电镜(SEM)、X射线衍射仪(XRD)、电子能谱(EDS)分析Cu-Te-Cr合金时效析出相的形貌与组成,研究合金元素对Cu-Te-Cr合金时效组织与性能的影响。结果表明,时效过程中Te、Cr以多元化合物或细小的单质Cr析出,合金的硬度明显升高,随时效温度的升高,Cr粒子长大,共格度降低;同时基体晶粒内,部分析出相重溶,使合金硬度下降;由于Cr和Te两种元素互不相溶,其交互作用生成CrxTey化合物,随着Te含量的增加,铸造过程中生成这种化合物越多,减少Cr元素在铜基体的固溶度,从而合金硬度下降,而导电率有所提高。

Effect of Alloy Elements on the Microstructure and Properties of Cu-Te-Cr Alloys During Aging Process

SEM,XRD and EDS were used to analyze the morphologies and composition of precipitations. The effects of alloy elements on the microstructure and properties of Cu - Te - Cr alloys during aging process were studied. The results showed that Te,Cr were precipitated as Cu2Te, Cr, Tey or fine bcc Cr during aging process, so the hardness of alloys can be improved. With aging temperature increasing, the grain size of Cr increases, coherent relation decreases and some precipitation re - solute in copper grain at the same time, leading to decrease of hardness of alloys. Furthermore, Cr, Tey appeared and increased with Te content increased, combined with solution of Cr in copper dropping, thus the hardness of alloys decreased but electrical conductivity increased.