叠层芯片应用的封装挑战与解决方法(英文)

叠层管芯封装的不断发展导致该技术能有效地在同一基底内增大电子器件的功能和容量,作为单个芯片。蜂窝电话及其它消费类产品中叠层芯片封装的应用增长促使能够在给定封装尺寸中封装多层芯片。介绍了叠层芯片封装技术中最主要是满足总封装高度的要求。用于叠层芯片封装的技术实现方法包括基片减薄、薄裸芯片贴装、小形貌引线键合、与无支撑的边缘键合以及小偏倒成形等。集中介绍了叠层管芯互连要求。介绍了倒装芯片应用中的正向球形键合、反向球形键合和焊凸凸焊技术,讨论了优点和不足。说明球形键合机的发展能够满足叠层芯片封装的挑战,即超低环形状、长引线跨距和悬空键合等。

Packaging Challenges and Solutions for Multi-Stack Die Applications

The continuous growth of stacked die packages is resulting from the technology's ability to effectively increase the functionality and capacity of electronic devices within the same footprint as a single chip. The increased utilization of stacked die packages in cell phone and other consumer products drives technologies that enable multiple die stacks within a given package dimension.