超精密表面研抛磨粒的研究进展

半导体材料的超精密加工是一种获得高表面质量和表面完整性的加工技术,研抛磨粒是实现半导体材料超精密加工的关键耗材之一。从研抛磨粒的组成方式和结构特点,概述了研抛磨粒的研究现状和发展趋势。首先,构建了研抛界面内半导体材料工件-研抛磨粒-研抛垫的接触模型,讨论了研抛磨粒的材质、形状、浓度、粒径等因素对半导体材料研抛质量和研抛效率的影响;其次,从材质和粒径等方面介绍了混合磨粒的研抛性能,以及相应的研抛机理;然后,从材料结构和化学作用等角度总结了复合磨粒在超精密加工技术中的应用;最后,展望了研抛磨粒未来的研究方向。

Research Progress of Ultra-Precision Surface Grinding and Polishing Abrasive Particles

Ultra-precision processing of semiconductor materials is a technology that achieves high surface quality and surface integrity. Grinding and polishing abrasive particles are one of the key consumables for achieving ultra-precision processing of semiconductor materials. The research status and development trend of grinding and polishing abrasive particles based on their composition and structural characteristics were summarized. Firstly, the contact model between the workpiece, abrasive particles and pad in the grinding and polishing interface was constructed, and the influences of the material, shape, concentration, and particle size of abrasive particles on the quality and efficiency of the grinding and polishing were discussed. Secondly, the grinding and polishing performance and the corresponding mechanism of mixed abrasive particles were introduced from the aspects of material and particle size. Thirdly, the application of composite abrasive particles in ultra-precision processing technology was summarized from the perspective of material structure and chemical action. Finally, the future research direction of grinding and polishing abrasive particles was prospected.