| 球形触点阵列与四边扁平封装的比较 |
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| 引用本文： | 朱颂春.球形触点阵列与四边扁平封装的比较[J].电子元件与材料,1996,15(1):12-15. |
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| 作者姓名： | 朱颂春 |
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| 作者单位： | 电子工业部第４３研究所 |
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| 摘 要： | 球形触点阵列（ＢＧＡ）封装技术作为一种新的封装技术越来越受到人们的重视。从安装率和成本、表面安装印制板设计以及焊点可靠性三个方面对球形触点阵列与四边扁平封装（ＱＦＰ）进行了比较。分析认为，ＢＧＡ和ＱＦＰ各有其优势和劣势，各有其应用重点。
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| 关 键 词： | 球形触点阵列，四边扁平封装，安装率，成本，焊点可靠性 |
Comparasion Between BGA and QFP |
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| Zhu Songchun.Comparasion Between BGA and QFP[J].Electronic Components & Materials,1996,15(1):12-15. |
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| Authors: | Zhu Songchun |
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| Affiliation: | Zhu Songchun |
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| Abstract: | More and more interests are shown in the ball grid array (BGA).A comparasion betweenBGA and quad flat package(QFP)has been made in the respects of the relation between mounting yield andcost,design of surface mounting PCB and reliability of soldering joints.The advantages and disadvantages andapplications of BGA and QFP are shown. |
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| Keywords: | ball grid array quad flat package mounting yield cost reliability of soldering joints |
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