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| 几种SMT焊接缺陷及其解决措施 | |
| 引用本文： | 路佳. 几种SMT焊接缺陷及其解决措施[J]. 电子工艺技术, 2000, 21(5): 201-203,206 |
| 作者姓名： | 路佳 |
| 作者单位： | 中物院电子工程研究所,四川,成都,621900 |
| 摘 要： | 主要针对采用了表面组装技术 (SMT)生产的印制电路组件中出现的焊料球、立片、桥接等几种焊接缺陷现象进行分析 ,并将有效的解决措施进行了经验性总结。 |
| 关 键 词： | 表面贴装技术 焊接缺陷 解决措施 |
Several SMT Soldering Defects and Measures to Solve Them |
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| LU Jia. Several SMT Soldering Defects and Measures to Solve Them[J]. Electronics Process Technology, 2000, 21(5): 201-203,206 | |
| Authors: | LU Jia |
| Abstract: | Analyse several soldering defects such as solder balls,manhatten,short circuit etc in printed circuit assembly that utilizes surface mount technology(SMT).Some valid measures are summarized on experience to eliminate these defects. |
| Keywords: | SMT Soldering defect Solving measure |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |