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Microstructural characterization of Cu/Al composites and effect of cooling rate at the Cu/Al interfacial region |
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| Authors: | Yan-qiu Han Li-hua Ben Jin-jin Yao Chun-jing Wu |
| Affiliation: | School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China |
| Abstract: | |
| Keywords: | composite materials copper aluminum temperature cooling rate interfaces diffusion bonding |
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