| 无铅银浆烧结工艺与导电性能研究 |
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| 引用本文： | 甘卫平,周华,张金玲.无铅银浆烧结工艺与导电性能研究[J].电子元件与材料,2010,29(4). |
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| 作者姓名： | 甘卫平 周华 张金玲 |
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| 作者单位： | 中南大学,材料科学与工程学院,湖南,长沙,410083 |
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| 摘 要： | 制备了无铅低温玻璃粉,将其与银粉和有机载体混合配制成无铅导电银浆并烧结。通过SEM和EDX观察浆料烧结银膜的形貌并进行成分分析,用四探针测试仪测量烧结银膜的电阻率,讨论了浆料成分配比、烧结时间、烧结温度等方面对银膜导电性能的影响。确定了无铅导电银浆的最佳配比为:质量分数w(银粉)72%,w(玻璃粉)3%和w(有机载体)25%,最佳烧结温度为580℃,最佳保温时间为5min。
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| 关 键 词： | 无铅银浆 无铅玻璃 导电性能 烧结工艺 |
Investigation of sintering process and electrical conductivity of the lead-free Ag paste |
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| GAN Weiping,ZHOU Hua,ZHANG Jinling.Investigation of sintering process and electrical conductivity of the lead-free Ag paste[J].Electronic Components & Materials,2010,29(4). |
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| Authors: | GAN Weiping ZHOU Hua ZHANG Jinling |
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| Affiliation: | School of Materials Science and Engineering;Central South University;Changsha 410083;China |
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| Abstract: | The lead-free low temperature glass powder was fabricated and lead-free conductive Ag paste was prepared and sintered by mixing the silver powder, the glass powder and the organic vehicle. The morphology of the paste sintered Ag film was observed by SEM, and ingredients, the resistivity were analyzed and measured by EDX, the four point probe meter, respectively. The effects of components of the paste, sintering time, sintering temperature on the conductive properties of Ag film were discussed. The optimal m... |
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| Keywords: | lead-free Ag paste lead-free glass electrical conductivity sintering process |
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