| 大功率LED封装用有机硅凝胶的固化行为 |
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| 引用本文： | 杨明山,颜宇宏,闫冉,刘长溪,刘洋.大功率LED封装用有机硅凝胶的固化行为[J].广东化工,2014(2):20-21. |
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| 作者姓名： | 杨明山 颜宇宏 闫冉 刘长溪 刘洋 |
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| 作者单位： | [1]北京石油化工学院材料科学与工科学院特种弹性体复合材料北京市重点实验室,北京102617 [2]北京化工大学理学院,北京100029 |
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| 基金项目： | 北京市科技专项-北京市科学技术委员会2012年度阶梯计划项目（Z121103009212042） |
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| 摘 要： | 文章将含氢硅油与端乙烯基硅油混合,在铂催化剂的作用下发生硅氢加成反应,得到无色透明的大功率LED封装用凝胶型有机硅材料。采用动态差示扫描量热仪对其固化行为进行了考察,获得了其固化动力学参数,其固化反应活化能为79.237 kJ/mol,固化反应级数为0.8271,起始固化温度在75℃左右,最大固化反应速率的温度在90℃左右,后固化温度在120℃左右,为大功率LED封装用凝胶型有机硅材料的封装工艺制定提供了基础数据。
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| 关 键 词： | 大功率LED 封装 有机硅凝胶 固化行为 |
The Curing Behavior of Organosilicone Materials for Large-power LED Packaging |
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| Yang Mingshan,Yan Yuhong,＇,Yan RanI,Liu ChangxiI,Liu Yang.The Curing Behavior of Organosilicone Materials for Large-power LED Packaging[J].Guangdong Chemical Industry,2014(2):20-21. |
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| Authors: | Yang Mingshan Yan Yuhong ＇ Yan RanI Liu ChangxiI Liu Yang |
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| Affiliation: | l (1. Department of Material Science and Engineering, Beijing Key Lab of Special Elastomer Composites Materials, Beijing Institute of PetrochemicalTechnology, Beijing 102617. 2. College of Science, Beijing University ofChemical Technology, Beijing 100029, China) |
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| Abstract: | The organosilicone gel material for large-power LED packaging was prepared through Si-H addition reaction of hydrogen-silicone with vinyl-silicone catalyzed by Pt coordination compound in this paper. The curing behavior was investigated by DSC method, and the curing dynamic parameters were obtained, i.e., the curing activation energy and reaction level of the system were 79.23 kJ/mol and 0.8271 respectively, the initial curing temperature, maximum curing temperature and post-curing temperature were 75 ℃, 90 ℃ and 120 ℃, respectively, which supplied the basic data for the preparation and application of organosilicone materials for large-power LED packaging. |
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| Keywords: | large-power light-emitting diode packaging silicone gel materials curing behavior |
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