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Microstructure evolution of Cu-Pb monotectic alloys during directional solidification |
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| Authors: | CUI Hong-bao GUO Jing-jie SU Yan-qing DING Hong-sheng WU Shi-ping BI Wei-sheng XU Da-ming FU Heng-zhi |
| Affiliation: | 1. School of Materials Science and Engineering, Central South University, Changsha, 410083, China;2. Department of Materials Science and Engineering, College of Engineering, University of Michigan, Ann Arbor, 48109-2136, USA;1. Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, PR China;2. School of Materials Science and Engineering, University of Science and Technology of China, Shenyang 110016, PR China;1. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an, Shaanxi, 710072, PR China;2. Univ. Grenoble Alpes, INSA Toulouse, Univ. Toulouse Paul Sabatier, EMFL, CNRS, LNCMI, 38000, Grenoble, France;1. The State Key Laboratory for Refractories and Metallurgy, Hubei Province Key Laboratory of Systems Science in Metallurgical Process, International Research Institute for Steel Technology, Wuhan University of Science and Technology, Wuhan, 430081, China;2. Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing, 100190, China |
| Abstract: | Planar, cellular and dendrite morphologies were observed at different concentrations in the directional solidification of Cu-Pb monotectic alloys. In Cu-Pb hypomonotectic alloys, the directional solidification microstructure changes from columnar dendrite to the irregular rod composite structure with increasing lead content and growth rate. In Cu-Pb hypermonotectic alloys, the structure changes from the band structure and elongated droplets to irregular rod composite structure with increasing growth rate. The range of composition of forming the rod composite structure around the monotectic points increases with the increasing growth rate. The transient morphology of Cu-Pb alloys in the directional solidification was obtained. The solid/liquid interface of Cu-Pb alloys presents planar and the second liquid droplets are pushed by growing front under the high temperature gradient. With increasing growth rate or decreasing temperature gradient the planar interface becomes unstable and the cellular structures with L2 phase at the cell boundaries are developed. |
| Keywords: | copper-lead monotectic alloy directional solidification transient morphology microstructure evolution |
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