藕状多孔铜微通道热沉的散热性能优化研究

藕状多孔铜是一种具有长直圆孔的新型微通道结构,可用于对大功率电子器件进行散热。通过实验和Flow Simulation数值计算系统地研究了以水为工质,具有均匀微槽道结构的多孔铜热沉的散热性能。实验结果表明,该热沉具有很高的换热系数,在110 m L/s流量下,换热系数可达10.1 W/(cm~2·K)。模拟结果表明存在最佳的微槽道数和微槽道方向使得多孔铜热沉的散热性能最优。以水为工质时,最佳槽道数和微槽道方向分别为7~11和45°。随着微槽道宽度减小,热沉散热性能提高,对比了数值模拟结果与实验结果,并分析了其存在差异的原因。

Study on Heat Transfer Enhancement of Lotus-type Porous Copper Heat Sink

Lotus-type porous copper is a new kind of micro-channel structure with long cylindrical pores aligned in one direction. It can be used as a heat sink for cooling of high-power electronic components. Through experiments and numerical simulations with Flow Simulation, the heat transfer performance of a lotus-type porous copper heat sink with uniform distributed micro-groove was systematically studied. The experimental results showed that this kind of heat sink has an excellent heat transfer coefficient, as high as 10.1 W/(cm2?K), only under a flow rate as low as 110 mL/s. The simulation showed that optimal number and angle of micro-groove existed for the heat sink to reach a maximal equivalent heat transfer coefficient. For water as its coolant, the optimal number and angle of micro-groove were 7-11 and 45°, respectively. And heat transfer performance of the heat sink continuously improved with decreasing of the width of micro-groove. The numerical simulation results were compared with the experimental results, and the reasons for the differences were analyzed.