| 热循环条件下SnAgCu/Cu焊点金属间化合物生长及焊点失效行为 |
| |
| 引用本文： | 肖慧,李晓延,李凤辉. 热循环条件下SnAgCu/Cu焊点金属间化合物生长及焊点失效行为[J]. 材料工程, 2010, 0(10) |
| |
| 作者姓名： | 肖慧 李晓延 李凤辉 |
| |
| 作者单位： | 北京工业大学,材料科学与工程学院,北京,100124;北京工业大学,材料科学与工程学院,北京,100124;北京工业大学,材料科学与工程学院,北京,100124 |
| |
| 基金项目： | 国家自然科学基金项目，北京市自然科学基金项目，广东省科技计划项目粤澳关键领域重点突破项目，广东省教育部产学研结合项目 |
| |
| 摘 要： | 研究了热循环过程中SnAgCu/Cu焊点界面金属间化合物的生长规律及焊点疲劳失效行为。提出了热循环条件下金属间化合物生长的等效方程以及焊点界面区不均匀体模型,并用有限元模拟的方法分析了热循环条件下焊点界面区的应力应变场分布及焊点失效模式。研究结果表明:低温极限较低的热循环,对应焊点的寿命较低。焊点的失效表现为钎料与金属间化合物的界面失效,且金属间化合物厚度越大,焊点中的累加塑性功密度越大,焊点越容易失效。
|
| 关 键 词： | 金属间化合物 SnAgCu/Cu焊点界面区 热循环 可靠性 有限元 |
Growth Kinetic of Intermetallic Compounds and Failure Behavior for SnAgCu/Cu Solder Joints Subjected to Thermal Cycling |
| |
| XIAO Hui,LI Xiao-yan,LI Feng-hui. Growth Kinetic of Intermetallic Compounds and Failure Behavior for SnAgCu/Cu Solder Joints Subjected to Thermal Cycling[J]. Journal of Materials Engineering, 2010, 0(10) |
| |
| Authors: | XIAO Hui LI Xiao-yan LI Feng-hui |
| |
| Affiliation: | XIAO Hui,LI Xiao-yan,LI Feng-hui(College of Materials Science , Engineering,Beijing University of Technology,Beijing 100124,China) |
| |
| Abstract: | The growth kinetic of intermetallic compounds(IMCs) and fatigue failure behavior of SnAgCu/Cu solder joints subjected to thermal cycling have been investigated.An equivalent IMC growth equation for thermal cycling and a heterogeneous model for solder joint interface were proposed,and the finite element(FEM) simulation was applied to analyze the stress/strain field distribution on solder joint interface as well as the failure mode of solder joints subjected to thermal cycling.The results show that the lower ... |
| |
| Keywords: | IMC SnAgCu/Cu solder joint interface thermal cycling reliability FEM |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
