| 半导体激光器封装中热应力和变形的分析 |
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| 引用本文： | 王辉.半导体激光器封装中热应力和变形的分析[J].半导体技术,2008,33(8). |
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| 作者姓名： | 王辉 |
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| 作者单位： | 中国电子科技集团公司,第十三研究所,石家庄,050051 |
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| 摘 要： | 为了解决半导体激光器封装的热应力和变形问题,利用有限元软件ANSYS对SnPb、In、AuSn三种焊料焊接激光器管芯的情况分别进行了模拟,得到了相应的热应力大小和变形情况,分析了焊料和热沉对激光器热应力和变形的影响.对比了这几种不同封装方法的激光器发光区图像的弯曲程度,验证了模拟结果.由模拟和实验结果可见,采用In焊料是减小激光器热应力和变形的最佳选择.另外,适当增加热沉厚度,选择热匹配的材料,焊接时进行预热,可减小激光器的热应力和变形.通过模拟和实验分析,提出了减小热应力和变形的方法,为优化激光器的封装设计提供了参考依据.
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| 关 键 词： | 半导体激光器 热应力 变形 焊料 封装 |
Thermal Stress and Deformation Analysis of Semiconductor Lasers Packaging |
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| Wang Hui.Thermal Stress and Deformation Analysis of Semiconductor Lasers Packaging[J].Semiconductor Technology,2008,33(8). |
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| Authors: | Wang Hui |
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| Affiliation: | Wang Hui(The 13th Research Institute,CETC,Shijiazhuang 050051,China) |
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| Abstract: | A key technology problem of semiconductor lasers packaging is to minimize thermal stress and deformation. We took use of software in simulating thermal stress and deformation of the lasers sintered by SnPb, In and AuSn solder respectively. The effect of different solder and heat sinks were calculated and analyzed using steady simulation method. The deformation of lasers by measuring emitting zone images of lasers were consistent with that of the simulation results. According to the simulation and experiment... |
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| Keywords: | semiconductor laser thermal stress deformation solder packaging |
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