| Sn基钎料与Cu和Al基板的润湿性比较研究 |
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| 引用本文： | 尹立孟,冼健威,周进.Sn基钎料与Cu和Al基板的润湿性比较研究[J].电子元件与材料,2011,30(1):75-78. |
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| 作者姓名： | 尹立孟 冼健威 周进 |
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| 作者单位： | 尹立孟,周进,YI Limeng,ZHOU Jin(重庆科技学院,冶金与材料工程学院,重庆,401331);冼健威,MAN Aanwei(华南理工大学,材料科学与工程学院,广东,广州,510640) |
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| 基金项目： | 重庆市教委科学技术研究资助项目 |
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| 摘 要： | 采用润湿平衡法测量了四种Sn基钎料(Sn-37Pb、Sn-3.OAg-0.5Cu、Sn-0.7Cu与Sn-9Zn)分别在250,260和270℃与Cu、Al两种基板的润湿性能.结果表明:钎料与Al基板的润湿时间均比Cu基板长,除Sn-9Zn外,其他三种钎料与Cu基板的润湿力比Al基板大,并且随着温度升高,润湿性能提高,...
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| 关 键 词： | Sn基舒料 润湿性能 Cu基板 Al基板 |
Comparison of wetting properties for Sn-based solders on copper and aluminum substrates |
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| YI Limeng,MAN Aanwei,ZHOU Jin.Comparison of wetting properties for Sn-based solders on copper and aluminum substrates[J].Electronic Components & Materials,2011,30(1):75-78. |
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| Authors: | YI Limeng MAN Aanwei ZHOU Jin |
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| Affiliation: | 1(1.School of Metallurgy and Materials Engineering,Chongqing University of Science and Technology,Chongqing 401331,China;2.School of Materials Science and Engineering,South China University of Technology,Guangzhou 510640,China) |
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| Abstract: | The wetting properties of four typical Sn-based solders,i.e.Sn-37Pb,Sn-3.0Ag-0.5Cu,Sn-0.7Cu and Sn-9Zn,on copper and aluminum substrates at 250,260 and 270 ℃ were evaluated adopting wetting balance method.The experimental results show that the wetting times of all solders on copper substrate are less than on aluminum substrate,the wetting forces of the solders with copper substrate are bigger than with aluminum substrate except Sn-9Zn solder.The wetting properties of the solders on aluminum substrate increases with the elevation of soldering temperature,the wetting force of Sn-9Zn increases most obviously among four solders and reaches 3.68 mN at 270 ℃.The experiments also show that the wetting properties of solders on copper substrate mainly depend on surface tension of solder alloy,however,depend on both surface tension of solder alloy and interaction with aluminum substrate on aluminum substrate. |
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| Keywords: | Sn-based solders wetting properties copper substrate aluminum substrate |
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