| DSC及IR联合测定环氧树脂-双氰胺体系固化工艺参数 |
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| 引用本文： | 蔡晋,董如林,陈智栋,金长春,方敏.DSC及IR联合测定环氧树脂-双氰胺体系固化工艺参数[J].江苏石油化工学院学报,2011(4):14-18. |
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| 作者姓名： | 蔡晋 董如林 陈智栋 金长春 方敏 |
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| 作者单位： | 常州大学石油化工学院,江苏常州213164 |
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| 摘 要： | 采用非等温DSC法研究了固化剂用量对环氧树脂固化反应的影响。同时利用不同升温速率下测得的DSC曲线研究了环氧树脂-双氰胺体系的固化反应动力学，并由DSC及IR分析技术确定了该体系的最佳反应条件。实验结果表明：固化剂双氰胺最佳用量为5．6％，最佳固化温度为403K，固化时间为70min，该体系的反应活化能为96．82kJ／mol，反应级数为0．93。
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| 关 键 词： | 环氧树脂 双氰胺 DSC IR 固化反应动力学 |
Determination of Curing Parameter for Epoxy Resin--Dicyandiamide System by DSC and IR |
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| CAI Jin,DONG Ru-lin,CHEN Zhi-dong,JIN Chang-chun,FANG Min.Determination of Curing Parameter for Epoxy Resin--Dicyandiamide System by DSC and IR[J].Journal of Jiangsu Institute of Petrochemical Technology,2011(4):14-18. |
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| Authors: | CAI Jin DONG Ru-lin CHEN Zhi-dong JIN Chang-chun FANG Min |
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| Affiliation: | ( School of Petrochemical Engineering, Changzhou University, Changzhou 213164, China) |
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| Abstract: | The effect of the amount of dicyandiamide on the curing reaction of epoxy resin has been investigated , using non--isothermal DSC method and the reaction kinetics of the epoxy resin--dicyandiamide system has been studied, using DSC curves measured at different heating rates. Simultaneously, the optimum curing condition has been established , using DSC and IR analytical technique. The experimental results indicate that the optimum amount of dicyandiamide is 5.6%, curing temperature 403K and curing time 70 min. The activation energy and reaction rate for the curing reaction of the epoxy resin--dicyandiamide system were calculated to be 96.82 kJ/mol and 0. 93, respectively. |
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| Keywords: | epoxy resin dicyandiamide DSCI IR curing reaction kinetics |
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