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侧面喷流对导通孔内镀液流动影响的数值研究
引用本文:廖钦,王雪涛,李志东.侧面喷流对导通孔内镀液流动影响的数值研究[J].印制电路信息,2010(Z1):85-91.
作者姓名:廖钦  王雪涛  李志东
作者单位:深圳市兴森快捷电路科技股份有限公司
摘    要:文章通过数值模拟研究了不同喷流速度、喷嘴孔径和喷嘴板面距离的侧面喷流对通/盲孔内镀液流动的影响。计算了单个圆形喷嘴喷流的轴对称流场,定量给出了喷流在板面的压力分布及其作用区大小,进而对孔内镀液流动特性进行了计算和讨论。计算结果表明:通孔和盲孔孔内镀液交换机制不同。通孔镀液交换主要受孔内外对流控制,孔内镀液流速与孔口压差成正比。盲孔镀液交换主要受孔内外镀液浓差控制。加强喷流可促进通孔内外镀液交换,但对厚径比大于1的盲孔内镀液交换几乎没有影响。

关 键 词:电镀  喷流  镀通率  数值模拟

Numerical research on the influence of a side-jet on the flow within via
LIAO Qin,WANG Xue-tao,LI Zhi-dong.Numerical research on the influence of a side-jet on the flow within via[J].Printed Circuit Information,2010(Z1):85-91.
Authors:LIAO Qin  WANG Xue-tao  LI Zhi-dong
Affiliation:LIAO Qin WANG Xue-tao LI Zhi-dong
Abstract:A numerical simulation of the flow of a side-jet in the plating solution is performed to investigate the influence of jet velocity, nozzle diameter and the relative position of nozzle on the flow within through hole or blind hole. A single round jet model was calculated in axisymmetric coordinate. The distribution of pressure and its effect region on the board were obtained quantificationally. According to the jet field, the characteristics of flow within hole were calculated and discussed. The numerical re...
Keywords:electroplating  jet  throwing power  numerical simulation  
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