激光微细熔覆柔性直写厚膜导带组织性能的研究

随着表面组装以及电子元器件的微型化和密集化程度增加．对内部互连导线微细化以及高质量高性能程度的要求日渐严格．而传统技术越米越不能满足这种快速发展的需求。采用激光微细熔覆柔性直写技术，在玻璃基板上直接制备高质量高性能的微细导带。通过控制各工艺参数的变化所引起组织形貌的变化判定形成导带的性能的好坏和质量的优劣，优化了工艺参数，并采用该参数进行实际图形的制备。结果表明．所制备的导带导电性好、结合强度高、焊接性好、表面平整度高，适合于产品的智能化批量生产和精微细图形的制作与修复。

Research on Structure Property of Thick-Film Conductive Lines Fabricated by Laser Micro-Fine Cladding and Flexibly Direct Writing

Nowadays, the electronic components are developing towards to high density compaction and miniaturization, which needs higher line densities and narrower line widths for interior interconnected conductive lines. However, the conventional technologies can not meet the rapidly growing need for their inherent limits. In this paper, based on the technique of laser micro-fine cladding and flexibly direct writing, micro-fine conductive lines of high quality and high property are fabricated on glass substrates. The properties and quality of conductive lines are adjusted by structure change with different processing parameters, so as to optimize parameters and make use of these parameters to fabricate the case patterns. The results showed that the conductive and welding properties of the conductive lines are high as well as bond strength and surface finish quality, therefore they are fit for fabrication and repair of products′ intellectual large-lot production and fine or micro-fine patterns.