A nodal analysis model for the out-of-plane beamshape electrothermal microactuator

This paper introduces a nodal analysis model for the out-of-plane beamshaped electrothermal microactuators. The electrothermal microactuator is traditionally simulated with finite element method (FEM) due to the complex coupling of the electrical, thermal and mechanical problem. This complex problem is classified into two parts in this paper: the coupling electrothermal problem and the coupling thermomechanical problem. By utilizing the characteristic of the temperature distribution, the nodal analysis model for the coupling electrothermal behavior of the electrothermal microactuator is built. The model scale is much smaller than the finite element model, which results in less computational consumption. Then the coupling thermomechanical behavior, such as the shift of the heat flow from the bottom of each part of the actuator to the substrate due to its out-of-plane movement, is modeled to make the model more reasonable. Many other effects which remarkably influence the behavior of the actuator are also taken into account. This model is verified by available experimental results, and achieves an agreement.