| 晶圆级CSP技术的发展展望 |
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| 引用本文： | 侯瑞田.晶圆级CSP技术的发展展望[J].电子工业专用设备,2008,37(5):64-67. |
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| 作者姓名： | 侯瑞田 |
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| 作者单位： | 国营第785厂第一研究所,山西,太原市,030024 |
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| 摘 要： | 简要阐述了集成电路的封装的发展趋势,对晶圆级CSP封装的现状和未来进行了简要论述。
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| 关 键 词： | 电子封装 倒装芯片 晶圆级CSP封装 3D封装 |
| 文章编号： | 1004-4507(2008)05-0064-04 |
| 修稿时间： | 2008年3月15日 |
The Trend of Wafer Level CSP Technology |
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| HOU Rui-tian.The Trend of Wafer Level CSP Technology[J].Equipment for Electronic Products Marufacturing,2008,37(5):64-67. |
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| Authors: | HOU Rui-tian |
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| Abstract: | There are many factors to affect final quality of electronic products.To most applications, the electronic packaging technology is somewhat more important than the IC design, because the reliability of products depends more and more on the packaging technology. This paper briefly describes the CSP packaging technology. |
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| Keywords: | AWLP CSP Flip chip lsic 3D |
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