Creep at low stresses: An evaluation of diffusion creep and Harper-Dorn creep as viable creep mechanisms

High-temperature creep experiments often reveal a transition at very low stresses to a region where the stress exponent is reduced to a value lying typically in the range of ∼1 to 2. This region is generally associated with the occurrence of a new creep mechanism, such as grain-boundary sliding, diffusion creep, and/or Harper-Dorn creep. Several recent reports have suggested that diffusion creep and Harper-Dorn creep may not be viable creep mechanisms. This article examines these two processes and demonstrates that there is good evidence supporting the occurrence of both creep mechanisms under at least some experimental conditions. This article is based on a presentation made in the workshop entitled “Mechanisms of Elevated Temperature Plasticity and Fracture,” which was held June 27–29, 2001, in San Diego, CA, concurrent with the 2001 Joint Applied Mechanics and Materials Summer Conference. The workshop was sponsored by Basic Energy Sciences of the United States Department of Energy.