Temperature Dependence of Creep and Hardness
of Sn-Ag-Cu Lead-Free Solder |
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| Authors: | YD Han HY Jing SML Nai LY Xu CM Tan J Wei |
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| Affiliation: | (1) School of Materials, Fulton School of Engineering, Arizona State University, Tempe, AZ 85287-8706, USA;(2) Present address: Assembly Technology Development, Intel Corp, Chandler, AZ, USA;(3) Present address: Kennametal Corp, Rogers, AK, USA;; |
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| Abstract: | The creep behavior and hardness of Sn-3.5Ag-0.7Cu solder were studied using Berkovich depth-sensing indentation at temperatures
of 25°C to 125°C. Assuming a power-law relationship between the creep strain rate and stress, an activation energy of 40 kJ/mol
and stress exponents of 7.4, 5.5, and 3.7 at 25°C, 75°C, and 125°C, respectively, were obtained. The results revealed that,
with increasing temperature, the creep penetration and steady-state creep strain rate increased whereas the stress exponent
decreased. The stress exponent and activation energy results also suggested that the creep mechanism is dislocation climb,
assisted by diffusion through dislocation cores in Sn. Furthermore, the hardness results exhibited a decreasing trend with
increasing temperature, which is attributed to softening at high temperature. |
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