铜基钎料焊接金刚石的界面结构与强度

选用Cu-Sn-Ti活性钎料在钢基体上焊接金刚石磨粒,研究钎料合金与金刚石焊接界面的组织形貌与物相组成,分析不同钎焊温度对焊接界面结构及结合强度的影响.结果表明,钎料合金元素与金刚石在钎焊过程中发生化学反应,生成化合物TiC,CuTi和CuSn等,实现了铜基钎料、金刚石颗粒与钢基体之间的化学冶金结合.当钎焊温度为880～930℃时,均可获得连接良好的钎焊接头;钎焊温度900℃时,焊接界面形成的化合物层均匀连续且界面致密,此时在相同磨削条件下,钎焊金刚石试件的磨损失重很小,达到了焊接界面的强力结合.

Interfacial structure and strength of Cu-based filler metal welding diamond

Cu-Sn-Ti active filler metal was selected to weld the diamond particles on the steel matrix.The organization features and phase compositions of the weld interface of solder alloy and diamond and were studied and the influences of brazing temperature on the interfacial structure and the bond strength were analyzed.The results show that solder alloy elements and diamond had chemical reaction in the process of brazing and compounds such as TiC,CuTi,and CuSn,were generated and the chemical metallurgical combination among Cu-based filler metal,diamond particles and the steel matrix were obtained.When the brazing temperature reaches to 880-930 ℃,soldered joints with good connection can be obtained.When the brazing temperature reaches to 900 ℃,the compound layer emerging on the weld interface is homogeneous,continuous,fine and close.At this moment,under the same grinding conditions,the abrasion weight loss of the brazed diamond specimen is very small,and the powerful bond of the weld interface is achieved.