半导体封装中的可视化技术

树脂传递模封装是广泛使用的可靠性量产性均好的半导体封装方法。但随着封装体（PACKAGE）尺寸的日益薄型化和多腿化，不可避免地会发生与树脂在模腔中流动状态有关的空隙等使制品失效的不良模式。这样，通过观察树脂流动状态及对空隙的分布进行研究，对于研究空隙发生机理从而抑制空隙发生具有重要意义。本文将着重介绍两种新的研究实验方法：（1）应用玻璃嵌入式新型可视化模具观察树脂在模腔中的流动状态；（2）采用超声波探查图像装置（简称SAT）进行树脂封装体内部的观察。

Visualization Technology of Semiconductor Packaging Process

Transfer molding is widely applied in semiconductor packaging technology by itssuperior in mass production and reliability. For a more thinner package with an increasingpin number, the avoidance of failure (for example, void) relating to the condition of in-mold resin flow is becoming important. Through the measuarent of resin flow behavior andvoids occurrence, we can study the mechanism of voids and find out the way to improve themounts of voids. In the present paper, two experiment metheds were introduced: Observ-ing the resin flow behavior by a new glass insert mold; Studying the amonts and distribu-tion of voids by SAT (Scanning Acoustic Tomograph).