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热超声键合PZT阻抗和功率动态特性研究
引用本文:隆志力,吴运新,韩雷,钟掘. 热超声键合PZT阻抗和功率动态特性研究[J]. 中国机械工程, 2006, 17(4): 396-400
作者姓名:隆志力  吴运新  韩雷  钟掘
作者单位:中南大学,长沙,410083
基金项目:中国科学院资助项目;科技部科研项目
摘    要:鉴于热超声芯片封装工艺的键合点空间高度局部化和时间瞬态性等特点,通过分析系统前端PZT阻抗和功率的动态变化规律,研究了芯片金球凸点与基板的键合过程及键合质量。结果表明:对于恒压源的键合系统,PZT换能器电流、阻抗及功率信号可表征键合过程的动态变化,且可将金球凸点与基板键合过程分为初始、平稳、结束三个阶段;键合环境的变化反映在PZT阻抗和功率变化之中,且PZT阻抗和功率与键合强度存在直接关系。试验及分析表明,PZT换能器阻抗和功率变化反映了金球凸点与基板键合过程及键合质量的差别,可用以分析整个键合系统。

关 键 词:PZT阻抗特性  PZT功率特性  键合过程  键合质量  热超声键合工艺
文章编号:1004-132X(2006)04-0396-05
收稿时间:2005-01-10
修稿时间:2005-01-10

Dynamic Characteristics of Impedance and Power of PZT Transducer in Thermosonic Bonding Process
Long Zhili,Wu Yunxin,Han Lei,Zhong Jue. Dynamic Characteristics of Impedance and Power of PZT Transducer in Thermosonic Bonding Process[J]. China Mechanical Engineering, 2006, 17(4): 396-400
Authors:Long Zhili  Wu Yunxin  Han Lei  Zhong Jue
Affiliation:Central South University, Changsha, 410083
Abstract:This investigation was to determine the bonding process and bonding quality between gold ball and substrate by dynamic characteristics of impedance and power of PZT rings which was at the front of transducer system. The experiments were carried out around input electrical signals of PZT, bonding strength and bonding parameters. The results show that, the bonding process can be expressed by the current change of PZT transducer, and can be divided into beginning phase, steady phase, and finish phase. Moreover, the changes of bonding parameters are reflected to the impedance and power of PZT transducer, and there is direct relationship among bonding strength and impedance and power of PZT transducer. It can be concluded that the dynamic characteristics of impedance and power of PZT transducer can be as good parameters to analyze the thermosonic bonding system.
Keywords:PZT impedance characteristics   PZT power characteristics   bonding process   bondingquality   thermosonic bonding process
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