| PCD与CVD金刚石显微组织及使用特性分析 |
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| 引用本文： | 赵建敏.PCD与CVD金刚石显微组织及使用特性分析[J].制造技术与机床,2002(11):44-46. |
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| 作者姓名： | 赵建敏 |
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| 作者单位： | 河南第一工具厂 |
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| 基金项目： | 国家 8 63高科技资助项目 (项目编号 :SZ - 38- 0 4 ) |
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| 摘 要： | 经对PCD与CVD金刚石厚膜显微组织的研究，发现气相沉积法生产的金刚石厚膜与PCD有着完全不同的组织形式。研制刀具并进行切削性能试验，验证了CVD金刚石厚膜刀具的切削适用范围，分析了它们在机械切削加工领域中的不同使用特性。
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| 关 键 词： | PCD CVD 金刚石 显微组织 使用特性 刀具材料 |
| 修稿时间： | 2001年4月9日 |
Analysis on Micro Structure and Use Characteristics of PCD and CVD Diamond |
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| ZHAO Jianmin.Analysis on Micro Structure and Use Characteristics of PCD and CVD Diamond[J].Manufacturing Technology & Machine Tool,2002(11):44-46. |
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| Authors: | ZHAO Jianmin |
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| Affiliation: | Henan No.1 Tool Plant |
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| Abstract: | By analyzing the microstructure of PCD and CVD diamond thick film, it is found that the diamond thick film produced by chemical vapor deposition has a structural form completely different from that of PCD. By developing tool and carrying out cut_performance test, the cutting application range for CVD diamond thick_film tool and PCD tool is proved, and different use characteristics of them in mechanical cutting field are analyzed. |
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| Keywords: | PCD CVD Use Characteristics |
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