Raman scattering of polycrystalline 3C-SiC film deposited on AlN buffer layer by using CVD with HMDS |
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Authors: | Gwiy-Sang Chung Kang-San Kim |
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Affiliation: | School of Electrical Engineering, University of Ulsan, San 29, Mugerdong, Namgu, Ulsan 680-749, Republic of Korea |
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Abstract: | ![]() This paper presents the Raman scattering characteristics of poly (polycrystalline) 3C-SiC thin films deposited on AlN buffer layer by atmospheric pressure chemical vapor deposition (APCVD) using hexamethyldisilane (MHDS) and carrier gases (Ar+H2). The Raman spectra of SiC films deposited on AlN layer of before and after annealing were investigated according to the growth temperature of 3C-SiC. Two strong Raman peaks, which mean that poly 3C-SiC admixed with nanoparticle graphite, were measured in them. The biaxial stress of poly 3C-SiC/AlN was calculated as 896 MPa from the Raman shifts of 3C-SiC deposited at 1180 °C on AlN of after annealing. |
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Keywords: | AlN Poly 3C-SiC Raman scattering HMDS |
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