Al2O3/Ti6Al4V diffusion bonding joints using Ag–Cu interlayer |
| |
Authors: | M.I. Barrena, L. Matesanz,J.M.G mez de Salazar |
| |
Affiliation: | aDepartment of Material Science, Faculty of Chemistry, Complutense University of Madrid 28040 Madrid, Spain |
| |
Abstract: | ![]() Ceramic materials, such us alumina, are widely used for wear resistant and industrial components as in aircraft applications. On the other hand, Ti6Al4V is commonly used for aeronautical applications, due to its superplasticity, low weight and high mechanical resistance but has poor wear resistance because of its low resistance to plastic shearing. For these reasons numerous techniques have been developed to improve its wear resistance including joining to ceramic materials. Ceramics and alloys can be joined by several different processes and the use of an interlayer can further facilitate this process. In the present work Al2O3 and Ti6Al4V alloy have been diffusion bonded using a (Ag–Cu) interlayer. Identification of intermetallic phases formed within the bonded region enables the mechanical behaviour of the joints to be explained. These intermetallic phases are related to the bonding conditions applied (750 °C, 3 MPa with bonding times varied from 10 to 60 min). |
| |
Keywords: | Diffusion bonding Interlayer Alumina Microstructure Mechanical properties |
本文献已被 ScienceDirect 等数据库收录! |
|