新型挠性印制电路板基材

目前挠性印制板仍以聚酰亚胺(PI)为基材,但PI的最大缺点是高的吸湿性函待改善,所以正努力开发高性能的高分子材料,以期取代PI。本文介绍了其中最有影响的两种新材料,即液晶聚合物(liquid crystal polymer,简称LCP)及聚醚醚酮(PEEK),其具有低吸湿性、低热膨胀系数、低介电常数及高尺寸稳定性。文章同时还介绍了LCP及PEEK在挠性印制板应用中遇到的问题及其解决方法。

The Application of the Substrate of Flexible Printing Circuit

Currently the substrate of flexible printing circuit still regards Polyamide as the sub- material , but thebiggest weakness of PI is the high hygroscopic power, so people work hard developing sub- material of the highperformance, to hope to replace the PI.This text introduces two kinds of new materials, namely LCP and PEEK. ,whichhave many advantages,.especially in the aspect of low hygroscopic power containing outstanding advantage. Thisarticle Still introduced the problem of LCP and PEEK and solution methods that meets in application.