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Low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy
Affiliation:1. Max Planck Institute for Intelligent Systems, D-70569 Stuttgart, Germany;2. Institute for Materials Science, University of Stuttgart, D-70569 Stuttgart, Germany
Abstract:The eutectic 80Au/20Sn solder alloy is widely used in high power electronics and optoelectronics packaging. In this study, low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy is reported. The 80Au/20Sn solder shows a quasi-static fracture characteristic at high strain rates, and then gradually transforms from a transgranular fracture (dominated by fatigue damage) to intergranular fracture (dominated by creep damage) at low strain rates with increasing temperature. Coffin-Manson and Morrow models are proposed to evaluate the low cycle fatigue behavior of the 80Au/20Sn solder. Besides, the 80Au/20Sn solder has enhanced fatigue resistance compared to the 63Sn/37Pb solder.
Keywords:Eutectic 80Au/20Sn solder alloy  Low cycle fatigue  Coffin-Manson model  Morrow model  Failure mechanism
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