| Abstract: | Nanoscale dot patterns of cobalt alloy were formed on a silicon substrate using the ultra‐violet nanoimprint lithography (UV‐NIL) technology in combination with an electrodeposition process. We developed an improved UV‐NIL equipment that can evacuate the chamber during imprinting. Using this equipment, we successfully imprinted 240‐nm dot patterns with 500 nm pitch on a photocurable resin with high dimensional accuracy. Thickness control of the resin and imprinting under vacuum are important issues to obtain fine nanopatterns. Using these resin patterns as a mask layer, 300‐nm cobalt alloy patterns are successfully formed by the electrodeposition process. Copyright © 2007 Institute of Electrical Engineers of Japan© 2007 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc. |
