抑制锡须的方法

无铅封装工艺是IC制造商为了顺应电子产品无铅化趋势而发展起来的,但存在晶须生成的潜在威胁。因此,锡须的抑制方法成为研究的关键。对电子集成电路封装行业中常见的9种抑制锡须的方法──避免局部镀纯锡,选择亚光或低应力镀锡,选择适宜的镀层厚度,选择适宜的阻挡层,纯锡镀层表面回流处理,退火处理,避免在纯锡镀层表面进行压负载操作,采用有机涂层或其它金属涂层,采用适宜的电镀添加剂等进行了总结,为IC业无铅电镀提供参考依据。

Methods of tin whiskers mitigation

A technics of lead-free package was developed by the IC manufacturers for electronic products in compliance with the lead-free trend.However,a potential risk of tin whiskers growth exists.Therefore,tin whiskers mitigation is the key for the lead-free product investigation.Nine kinds of whiskers mitigation methods generally used for IC package industry,including avoiding a local pure tin plating,choice of semi-gloss or low stress tin plating,choice of suitable film thickness or barrier layer,surface reflow treatment of pure tin deposit,annealing treatment,avoiding the operation of press and load on the surface of pure tin deposit,use of organic coating or other metallic coatings and a suitable plating additive etc,were summarized with a view to providing a reference and basis for the IC industry lead-free plating.