| Z900MCM综述 |
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| 引用本文： | 李双龙.Z900MCM综述[J].电子元件与材料,2003,22(7):46-48. |
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| 作者姓名： | 李双龙 |
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| 作者单位： | 国营第七四九厂,甘肃,天水,741000 |
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| 摘 要： | 介绍了Z900 MCM设计和布局,可控塌陷芯片连接(C4)工艺在Z900 MCM组装中的应用。从设计上通过加入垂直电感器及去耦电容器减小其噪声。通过基板测试和功能测试,剔除有缺陷的基板和芯片。Z900 MCM采用先进的MCM—D技术和MCM返工及冷却技术。Z900 MCM平均无故障时间高达40年。
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| 关 键 词： | MCM C4工艺 返工 测试 冷却模块单元 |
| 文章编号： | 1001-2028(2003)07-0046-03 |
A Review of Z900 MCM |
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| LI Shuang-long.A Review of Z900 MCM[J].Electronic Components & Materials,2003,22(7):46-48. |
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| Authors: | LI Shuang-long |
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| Abstract: | Z900 MCM is discussed regarding its design, layout, and the application of the controlled collapse chip connection technology in Z900 MCM assemblies. The noise can be reduced by using vertical dc inductors and decoupbing capacitors. Defect substrates and chips can be detected by testing the substrates and Z900 MCM performances. With advanced MCM-D technology, MCM rework process and cooling technology, the mean time between failures of Z900MCM can reache forty years. |
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| Keywords: | MCMs controlled collapse chip connection technology rework test modular cooling unit |
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