| 对集成电路封装塑封料湿敏性评定技术的探讨 |
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| 引用本文： | 杨建生,徐元斌.对集成电路封装塑封料湿敏性评定技术的探讨[J].电子与封装,2002,2(3):15-18. |
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| 作者姓名： | 杨建生 徐元斌 |
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| 作者单位： | 天水永红器材厂技术中心,甘肃,天水,741000 |
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| 摘 要： | 在有关塑封料的湿度浸入研究中,湿气或者是穿过聚合物渗透,或者是沿着引线与密封树脂之间的界面渗透。本文主要是通过试验对与湿度渗透有关的新一代树脂的特性给予评定,并判定引线框架通路是如何影响湿度浸入的。
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| 关 键 词： | 集成电路封装 塑封料 湿度浸入 树脂特性 |
| 修稿时间： | 2001年11月14 |
Research for Evaluation of the Moisture Sensitivity of Molding Compounds of IC Packages |
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| YANG Jian-sheng XU Yuan-bing.Research for Evaluation of the Moisture Sensitivity of Molding Compounds of IC Packages[J].Electronics & Packaging,2002,2(3):15-18. |
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| Authors: | YANG Jian-sheng XU Yuan-bing |
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| Abstract: | Moisture can penetrate either through the polymer or along the interface between the leads and the encapsulation resin in the study of moisture ingress within molding compounds of plastic pack- ages.The purpose of the article is to evaluate the behavior of new generation resins relatively to the moisture penetration,and to determine how the presence of a lead frame path can affect this ingress. |
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| Keywords: | IC packages Molding compounds Moisture ingress Characteristics of the resins |
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