Adhesion-Delamination Mechanics of a Prestressed Circular Film Adhered onto a Rigid Substrate

A thin circular film clamped at the periphery is adhered to the planar surface of a rigid cylindrical punch. An external tensile load is applied to the punch, causing the film to delaminate from the substrate and the circular contact edge to contract. The film spontaneously separates from the punch, or pulls off, when the contact radius reduces to a range between 0.1758 and 0.3651 of the film radius, depending on the magnitude of the residual membrane stress. The mechanical delamination process is derived by a thermodynamic energy balance based on a coupled interfacial adhesion and residual membrane stress. The theoretical model has significant implications in nanoforce measurement, microelectromechanical systems (MEMS) comprising active moveable films, and biological cell adhesion.