光学玻璃磁性复合流体抛光应力与材料去除率的实验研究

根据光学玻璃元件超精密加工技术的需求,研究自旋转式和行星旋转式磁性复合流体(MCF)抛光的应力分布和材料去除率。首先,设计可实现自旋转和行星旋转抛光装置,搭建抛光实验平台;然后,进行自旋转式和行星旋转式MCF抛光实验,通过自行设计抛光应力分布测试实验分析了两种抛光方式的应力分布规律;最后,通过定点抛光实验,对抛光前后的工件表面轮廓进行检测,计算并分析两种抛光方式的材料去除率。实验结果表明,立式的两种抛光方式,正应力均明显大于剪切应力,工件外侧受到的剪切应力大于中心受到的剪切应力,行星式抛光的材料去除率明显大于自旋转式抛光的材料去除率。

Experimental study on the stress and material removal rate of optical glass by MCF polishing

According to the requirement of ultra-precision machining technology of optical glass elements,the stress distribution and material removal rate of rotary and planetary rotary magnetic composite fluid(MCF) polishing are studied.Firstly,polishing device is designed that can realize the self-rotation and planet-rotation,and experimental platform is built;Then,MCF polishing stress test of the self-rotation and planet-rotation experiments is designed.Stress distribution of two kinds of polishing is studied;Finally,through spot-polishing experiments,surface profile of workpiece is detected and the removal rate of two kinds of polishing is analyzed and calculated.The experimental results show that the positive pressure of the two kinds of polishing is greater than that of the shear stress,and the shear stress on the outside of the polishing workpiece is greater than that of the core in the two polishing methods.The material removal rate of the planet-polishing workpiece is significantly greater than the material removal rate of the self-rotating polishing.