| HDI多层板走过二十年(1)——对二十年来HDI多层板及其基板材料技术创新的评析 |
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| 引用本文： | 祝大同.HDI多层板走过二十年(1)——对二十年来HDI多层板及其基板材料技术创新的评析[J].印制电路信息,2011(7):7-12,21. |
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| 作者姓名： | 祝大同 |
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| 作者单位： | 中国电子材料行业协会经济技术管理部，北京，100028 |
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| 摘 要： | 对近二十年来多层板及其基板材料技术发展的过程、特点、趋势等做了回顾与分析,并对它的未来发展做了展望。
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| 关 键 词： | HDI多层板 PCB CCL 发展 |
HDI multilayer circuit board of twenty years (1) Review of innovation of HDI multilayer circuit board and substrate material since twenty years |
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| ZHU Da-tong.HDI multilayer circuit board of twenty years (1) Review of innovation of HDI multilayer circuit board and substrate material since twenty years[J].Printed Circuit Information,2011(7):7-12,21. |
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| Authors: | ZHU Da-tong |
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| Affiliation: | ZHU Da-tong |
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| Abstract: | In the paper,process,character and trend of HDI multilayer circuit board and substrate material were analyzed.At the same time,the future was expected about HDI multilayer circuit board and substrate material. |
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| Keywords: | HDI multilayer circuit board PCB CCL Development |
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