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Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review |
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| Authors: | Wang Xi Zhang Liang Li Mu-lan |
| Affiliation: | 1.School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou, 221116, China ;2.State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China ; |
| Abstract: | Journal of Materials Science: Materials in Electronics - Electronic devices need to work at high temperature in some fields for a long time, peculiarly step soldering technology, primary packaging... |
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| 本文献已被 SpringerLink 等数据库收录！ | |