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DKJ-Ⅰ型大片玻璃打孔机
引用本文:陆宏,孙富. DKJ-Ⅰ型大片玻璃打孔机[J]. 仪表技术与传感器, 1996, 0(3)
作者姓名:陆宏  孙富
作者单位:沈阳仪器仪表工艺研究所,沈阳仪器仪表工艺研究所 沈阳市 110043,沈阳市 110043
摘    要:大片玻璃打孔机是一台硅压力传感器的生产设备。文章介绍了该设备的加工机理、设计原则、机床结构和技术指标;结合设备所采用的超声波多工具钻孔技术;解决的关键技术和整机的实用效果。

关 键 词:玻璃  钻孔  传感器  超声波  打孔机

Model DKJ-I Drilling Machine for Large Glass Wafers
Lu Hong and Sun FuShenyang Institute of Instrumentation Technology,Shenyang .. Model DKJ-I Drilling Machine for Large Glass Wafers[J]. Instrument Technique and Sensor, 1996, 0(3)
Authors:Lu Hong  Sun FuShenyang Institute of Instrumentation Technology  Shenyang .
Affiliation:Lu Hong and Sun FuShenyang Institute of Instrumentation Technology,Shenyang 110043.
Abstract:The drilling machine for large glass wafer processing is a production machine for silicon pressure sensors. This paper introduces the operating theory, design principle, mechanical structure and technical specifications. In combination with the ultrasonic multi-tooling techniques, the key problems tackled in the research and the practical application of the machine are also presented.
Keywords:Glass   Drilling   Sensor   Ultrasonic   Driller.
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